LevelC-UNLIM. 0 to 74F SN74FNSRG4. ACTIVE. SO. NS. . Reproduction of significant portions of TI information in TI data sheets is . 74F datasheet, 74F circuit, 74F data sheet: FAIRCHILD – Dual JK Negative Edge-Triggered Flip-Flop,alldatasheet, datasheet, Datasheet search site. 74F Datasheet, 74F Dual J-K Negative Edge-triggered Flip-Flop Datasheet, buy 74F

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74F112 Dual J-K Negative Edge-triggered Flip-flop

A low level at the preset PRE or clear CLR inputs sets or resets the outputs regardless of the levels of the 74f1112 inputs. When PRE and CLR are inactive high 774f112, data at the J and K inputs meeting the setup time requirements is transferred to 74112 outputs on the negative-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse.

Following the hold-time interval, data at the J and K inputs may be changed without affecting the levels at the outputs. Furthermore, this configuration is nonstable; that is, it will not persist when either PRE or CLR returns to its inactive high level.

Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input voltage ratings may be exceeded provided the input current ratings are observed.

74F00, 74F00, – 1 pages datasheet sitemap ::

ICC is measured with all outputs open, the Q and Q outputs alternately high and the clock input grounded at the time of measurement. Load circuits and waveforms are shown in Section 1. Product device recommended for new designs. TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

Device has been announced dataseet is not in production. Samples may or may not be available. TI has discontinued the production of the device.

TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free datxsheet.

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This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.

Finish options are separated by a vertical ruled line. Important Information and Disclaimer: The information provided on this page represents TI’s knowledge and belief as of the date that it is provided.

TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI’s liability dataeheet out of such information exceed the total purchase price of the TI part s at issue in this document sold by TI to Customer on an annual basis.

Buyers should obtain the latest relevant information before placing dqtasheet and should verify that such information is current and complete.

Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

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Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation.

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TI is not responsible datasheeet liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI.

Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications.

Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III or similar life-critical medical equipment unless authorized officers of the parties have executed a special 74c112 specifically governing such use.

74F (PHILIPS) PDF技术资料下载 74F 供应信息 IC Datasheet 数据表 (2/10 页)

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